MEMS 132: MEMS Packaging
Loading...
Keywords
MEMS - Micro-Electromechanical Systems
Project
Authors
Date Submitted
2022-08
Material Type
Instructor and/or Advisor/Case Manager Support Materials
Secondary Material Type
Institution
Lorain County Community College
Industry Partner
License
CC BY
Funding Source
Additional Public Access
Abstract
The course focuses on microelectronic integrated circuit (IC) and chip-on-board packaging. The student will be introduced to common packaging techniques and equipment used in the industry such as epoxy die attach, thermosonic wire bonding of 0.001” diameter wire, encapsulation, and microscope metrology.
Industry (NAISC)
Manufacturing -- Electrical Equipment, Appliance, and Component Manufacturing (335)
Occupation (SOC)
Production Occupations -- Numerical Tool and Process Control Programmers (51-4012)
Instructional Program (CIP)
Engineering Technologies/Technicians (15)
Credit Type
Credential Type
Certificate
Credential
Stacked/Latticed Credential Model
Associate Degree
Bachelors Degree
Credential
Stacked/Latticed Credential Model
Associate Degree
Bachelors Degree
Educational Level
Skill Level
Entry Level