3D Printing
Loading...
Keywords
Higher education employment workforce training occupational sector industry college credit
Project
CUNY CareerPATH
Authors
N/A, N/A
Date Submitted
2014-02-01
Material Type
Program
Secondary Material Type
Syllabus
Institution
City University of New York
Industry Partner
N/A
License
CC BY
Funding Source
TAACCCT Round 1
Additional Public Access
Abstract
This resource contains syllabus and curriculum materials along with 3D printing methods.
Industry (NAISC)
Developmental Education
Occupation (SOC)
Architecture and Engineering Occupations -- Computer Hardware Engineers (17-2061)
Instructional Program (CIP)
Engineering Technologies/Technicians (15)
Credit Type
Credential Type
Certificate
Educational Level
1st year Community College or equivalent